Manufacturing and System Assembly
A Comprehensive Approach
Equipment available to manufacture products includes Pick and Place Machines, Solder Paste Stencillers, and Convection Reflow Ovens, Wave Soldering etc.
R.F. Technologies manufacturing abilities include both Through Hole technologies and Surface Mount designs.
R.F. Technologies electronics manufacturing and cable assemblies are built to the latest International Standards including: IPC-SM-782, IPC-D-275, IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC-7711A and IPC7721A.
Manufacturing services offered include:
Component identification, sourcing and supply
Small to Medium run production manufacturing
High volume manufacturing analysis and recommendation
Repair and maintenance
Factory acceptance testing
Full functional testing
Product modification and rework
Cable and wiring harness design, assembly and testing
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Engineering Research, design, manufacturing, repairs, maintenance, and product obsolescence. Microelectronics, RF, microwave and digital design
Digitisation of the analogue and RF domain
Test and measurement system design
Field based radio system performance investigation including analysis of spectrum and RF sensitivity, including interference identification and mitigation
Antenna radiation pattern measurement
Manufacturing
High mix, low volume quantities
Class 3 manufacturing and ESD controls
Surface mount (SMT) printed circuit assembly (PCBA)
Manual inspection and assembly to IPC standards
First Article Inspection (FAI) Vacuum sealing of moisture sensitive materials
Temp and humidity-controlled work areas
Automatic optical and X-ray inspection (early 2019)
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