Manufacturing and System Assembly

A Comprehensive Approach

Equipment available to manufacture products includes Pick and Place Machines, Solder Paste Stencillers, and Convection Reflow Ovens, Wave Soldering etc.

R.F. Technologies manufacturing abilities include both Through Hole technologies and Surface Mount designs.

R.F. Technologies electronics manufacturing and cable assemblies are built to the latest International Standards including: IPC-SM-782, IPC-D-275, IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC-7711A and IPC7721A.

Manufacturing services offered include:

  • Component identification, sourcing and supply

  • Small to Medium run production manufacturing

  • High volume manufacturing analysis and recommendation    

  • Repair and maintenance       

  • Factory acceptance testing

  • Full functional testing

  • Product modification and rework

  • Cable and wiring harness design, assembly and testing

  • Engineering Research, design, manufacturing, repairs, maintenance, and product obsolescence. Microelectronics, RF, microwave and digital design 

  • Digitisation of the analogue and RF domain 

  • Test and measurement system design 

  • Field based radio system performance investigation including analysis of spectrum and RF sensitivity, including interference identification and mitigation 

  • Antenna radiation pattern measurement  

  • Manufacturing 

  • High mix, low volume quantities 

  • Class 3 manufacturing and ESD controls 

  • Surface mount (SMT) printed circuit assembly (PCBA) 

  • Manual inspection and assembly to IPC standards 

  • First Article Inspection (FAI) Vacuum sealing of moisture sensitive materials  

  • Temp and humidity-controlled work areas 

  • Automatic optical and X-ray inspection (early 2019) 

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